Job Summary
The Purdue Applied Research Institute (PARI) and Purdue University are experiencing rapid growth in multiple areas of microelectronics research. Through our partnerships with Navel Surface Warfare Center Crane Division (NSWC Crane), DARPA, imec, and other government and industry partners, we plan to be at the center of microelectronics research for the heartland. PARI is thus seeking summer research interns in STEM fields relevant to microelectronics to support these efforts. PARI is soliciting candidates from freshman to senior level to support research endeavors based in Crane, IN. Through a partnership between PARI and NSWC Crane, students will have the opportunity to work on projects focused on microelectronics for DoD applications. Interns will work collaboratively with NSWC Crane labs and PARI staff located at the adjacent Westgate facility. Some projects may also include collaboration with regional microelectronics industrial base facilities at Westgate.
The successful candidates will play a pivotal role in our research and development efforts, contributing to the design, fabrication, characterization, and packaging of novel microelectronic devices and circuits. As a Research Engineer at PARI, you will collaborate with cross-functional teams to drive innovation, solve complex technical challenges, and develop state-of-the-art microelectronics technologies. PARI is seeking research engineers that can lead or support research in multiple areas of advancing the state of the art in microelectronics. Candidates with recent and relevant experience in one or more of these areas will be most successful.
Education
Enrolled in undergraduate program in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or related STEM fields relevant to microelectronics
Candidates who have completed at least one year of their program will be considered
Salary and responsibilities will be commensurate with the candidate’s experience
Candidates must be able to obtain a Secret or Top Secret security clearance to be considered for this position. Maintaining this clearance is a continuous condition of employment.
US Citizenship is a requirement to be fully considered for this position.
Background in heterogeneous integration and advanced packaging favored
Experience
Experience in systems engineering and Model-Based Systems Engineering favored
Experience in semiconductor fabrication processes, including lithography, deposition, etching, and material characterization favored
Background in microelectronics device and circuit design, including familiarity with CAD tools and simulation software favored
Experience in testing and characterizing microelectronic devices using state-of-the-art equipment and measurement techniques favored
Excellent problem-solving skills and the ability to work collaboratively in cross-functional teams
Strong communication skills, both written and verbal, with the ability to present complex technical concepts effectively
Additional Information
Paid internship position
Purdue will not sponsor employment authorization for this position
A background check will be required for employment in this position. Pre-employment checks are required for this position.
Purdue University is an EOE/AA employer. All individuals, including minorities, women, individuals with disabilities, and veterans are encouraged to apply
This position represents multiple vacancies