Job Summary
The Purdue Applied Research Institute, LLC (PARI) Microelectronics Lab is seeking a Microelectronics Research Intern to support PARI applied research initiatives during the Fall 2026 and Spring 2027 semesters. This internship focuses on advancing shared program interests in advanced semiconductor packaging, heterogeneous integration, and advanced thermal cooling solutions relevant to next‑generation microelectronics systems.
The intern will work entirely on the Purdue University campus, engaging directly with Purdue faculty, university laboratories, and PARI subject matter experts (SMEs). The position is designed to provide meaningful, hands‑on laboratory and research experience while exposing the intern to applied research at the intersection of academia and a national security mission‑oriented research institute.
Key Responsibilities
Time Commitment - 5 hours per week
Support PARI research efforts in advanced thermal management and cooling solutions microelectronic devices and systems
Perform literature reviews and hands‑on laboratory work, including experimental setup, data collection, testing, and basic analysis
Collaborate closely with Purdue faculty and students in university laboratories.
Engage with PARI SMEs to understand applied research objectives and system‑level considerations
Assist with documentation of experimental methods, results, and technical findings
Participate in technical discussions, research meetings, and progress reviews as appropriate to project needs
Occasional lab work and meetings at the PARI MIcroelectronics Lab in Bloomington, IN.
Education
Enrolled undergraduate student at Purdue University in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related STEM discipline relevant to microelectronics
A student member of SCALE
Completion of at least one year of academic coursework by the start of the internship
Experience
US Citizenship is a requirement to be fully considered for this position
Active interest in microelectronics research and hands‑on laboratory work.
Ability to work effectively both independently and as part of a multidisciplinary research team
Strong written and verbal communication skills
Background or coursework in heterogeneous integration or advanced semiconductor packaging
Exposure to thermal management or cooling technologies for electronic systems
Familiarity with microelectronics device or system design concepts, modeling, or simulation tools
Experience in testing and characterizing microelectronic devices using state-of-the-art equipment and measurement techniques
Prior laboratory or research experience in an academic or applied research setting
Additional Information
Paid internship position
PARI is an EOE/AA employer. All individuals, including minorities, women, individuals with disabilities, and veterans are encouraged to apply
PARI will not sponsor employment authorization for this position
A background check will be required for employment in this position. Pre-employment checks are required for this position
FLSA: Exempt (Not Eligible For Overtime)