Job Summary
The Purdue Applied Research Institute, LLC (PARI) Microelectronics Lab is seeking a Microelectronics Research Intern to support research and applied engineering efforts in advanced semiconductor packaging, with a specific emphasis on 2.5D silicon (Si) interposer technologies.
This position is based on the Purdue University campus and provides the intern an opportunity to support a PARI project focused on supporting the development of a domestic silicon interposer fabrication capability. PARI’s role is to test and characterize prototype and production silicon interposers and apply the lessons learned to develop a Design-For-Test guidebook for design and manufacturability of interposer technologies. The intern will collaborate with PARI subject matter experts (SMEs) to support interposer‑focused activities ranging from design evaluation to failure analysis.
Key Responsibilities
Time Commitment - 5 hours per week
Support programmatic activities related to advanced packaging technologies, specifically 2.5D silicon interposers
Participate in interposer design reviews, including evaluation of technical requirements, layouts, and integration considerations
Collaborate closely with PARI SMEs to understand system‑level drivers, constraints, and application needs
Assisting in the development of Design For Test best practices
Hands-on test and characterization of silicon interposers
Contribute to documentation of technical findings, design observations, meeting outcomes, test data collection and analysis, and supporting materials
Participate in technical discussions with faculty, researchers, and industry and government partners as appropriate to project needs
Occasional lab work and meetings at the PARI MIcroelectronics Lab in Bloomington, IN.
Education
Enrolled undergraduate or graduate student at Purdue University in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or a related STEM discipline relevant to microelectronics
Must be a student member of SCALE
Completion of at least one year of academic coursework by the start of the internship
Experience
US Citizenship is a requirement to be fully considered for this position
Demonstrated understanding of semiconductor fabrication processes, including lithography, deposition, etching, and material characterization
Ability to work effectively both independently and as part of a multidisciplinary research team
Strong written and verbal communication skills
Background or coursework in heterogeneous integration or advanced semiconductor packaging
Familiarity with semiconductor device structures, routing, or packaging design concepts
Additional Information
Paid internship position
PARI is an EOE/AA employer. All individuals, including minorities, women, individuals with disabilities, and veterans are encouraged to apply
PARI will not sponsor employment authorization for this position
A background check will be required for employment in this position. Pre-employment checks are required for this position
FLSA: Exempt (Not Eligible For Overtime)